Heat-conductive paste X5 High Performance
Xilence X5 thermal paste was specifically designed for high-end processors. The very high thermal conductivity ensures for an efficient heat exchange and low temperatures! The paste works reliably at temperatures from -50 to +300°C – therefore, it is particularly well suited for extreme overclocking. Since the X5 is not electrically conductive, there is no danger for the surrounding hardware! Contents: 2.5 g.
|Heat conductance||1.45 W/(K·m)|
|Thermal resistance||0.023°C cm²/W|
|Dielectric constant A||> 6|
|Operation temperature||-50 ~ +300°C|
|Dimension||10 x 110 x 25mm|